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| BCM847BS NPN matched double transistor; hFE = 10 % Rev. 02 -- 6 April 2005 Product data sheet 1. Product profile 1.1 General description NPN matched double transistor in a SOT363 (SC-88) SMD plastic package. Matched version of BC847BS. The transistors are fully isolated internally. PNP equivalent: BCM857BS. 1.2 Features s Current gain matching s Base-emitter voltage matching 1.3 Applications s Current mirror s Differential amplifier 1.4 Quick reference data Table 1: Symbol VCEO IC hFE hFE VBE Quick reference data Parameter collector-emitter voltage collector current DC current gain hFE matching VBE matching VCE = 5 V; IC = 2 mA VCE = 5 V; IC = 2 mA VCE = 5 V; IC = 2 mA Conditions open base Min 200 Typ 290 Max 45 100 450 10 2 % mV Unit V mA Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 2. Pinning information Table 2: Pin 1 2 3 4 5 6 Pinning Description emitter TR1 base TR1 collector TR2 emitter TR2 base TR2 collector TR1 1 2 3 1 2 sym020 Simplified outline 6 5 4 Symbol 6 5 4 TR2 TR1 3 3. Ordering information Table 3: Ordering information Package Name BCM847BS SC-88 Description plastic surface mounted package; 6 leads Version SOT363 Type number 4. Marking Table 4: Marking codes Marking code [1] M1* Type number BCM847BS [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 9397 750 14722 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 -- 6 April 2005 2 of 8 Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM Ptot Tstg Tj Tamb Per device Ptot [1] Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) peak collector current total power dissipation storage temperature junction temperature ambient temperature total power dissipation Conditions open emitter open base open collector single pulse; tp 1 ms Tamb 25 C Min -65 -65 Max 50 45 6 100 200 200 +150 150 +150 300 Unit V V V mA mA mW C C C mW Per transistor Tamb 25 C [1] - Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6: Symbol Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] Min - Typ - Max 416 Unit K/W Per device Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 9397 750 14722 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 -- 6 April 2005 3 of 8 Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 7. Characteristics Table 7: Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Per transistor ICBO collector-base cut-off VCB = 30 V; IE = 0 A current VCB = 30 V; IE = 0 A; Tj = 150 C emitter-base cut-off current DC current gain collector-emitter saturation voltage base-emitter saturation voltage base-emitter voltage VEB = 5 V; IC = 0 A VCE = 5 V; IC = 10 A VCE = 5 V; IC = 2 mA VCEsat VBEsat VBE Cc Ce fT IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA VCE = 5 V; IC = 2 mA VCE = 5 V; IC = 10 mA collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz emitter capacitance transition frequency VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz VCE = 5 V; IC = 10 mA; f = 100 MHz VCE = 5 V; IC = 2 mA VCE = 5 V; IC = 2 mA [1] Conditions Min 200 610 100 Typ 250 290 50 200 760 910 660 11 250 Max 15 5 100 450 200 400 710 770 1.5 - Unit nA A nA IEBO hFE mV mV mV mV mV mV pF pF MHz Per device hFE VBE [1] DC current gain matching base-emitter voltage matching - - 10 2 % mV Pulse test: tp 300 s; 0.02. 9397 750 14722 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 -- 6 April 2005 4 of 8 Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 8. Package outline 2.2 1.8 6 5 4 0.45 0.15 1.1 0.8 2.2 1.35 2.0 1.15 pin 1 index 1 0.65 1.3 Dimensions in mm 2 3 0.3 0.2 0.25 0.10 04-11-08 Fig 1. Package outline SOT363 (SC-88) 9. Packing information Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number BCM847BS Package SOT363 Description 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 [1] [2] [3] [2] [3] Packing quantity 3000 -115 -125 10000 -135 -165 For further information and the availability of packing methods, see Section 14. T1: normal taping T2: reverse taping 9397 750 14722 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 -- 6 April 2005 5 of 8 Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 10. Revision history Table 9: Revision history Release date 20050406 Data sheet status Product data sheet Change notice Doc. number 9397 750 14722 Supersedes BCM847BS_1 Document ID BCM847BS_2 Modifications: BCM847BS_1 * * Table 7 Revaluation of data according to the latest control samples Table 7 ICBO unit for conditions VCB = 30 V; IE = 0 A; Tj = 150 C amended to A Product data sheet 9397 750 13711 - 20040914 9397 750 14722 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 -- 6 April 2005 6 of 8 Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 11. Data sheet status Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 12. Definitions Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 13. Disclaimers Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 14. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 14722 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 -- 6 April 2005 7 of 8 Philips Semiconductors BCM847BS NPN matched double transistor; hFE = 10 % 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 5 5 6 7 7 7 7 (c) Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 6 April 2005 Document number: 9397 750 14722 Published in The Netherlands |
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